インダクタの基本構造

著者: MagTop
2022-06-20
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1.スケルトンスケルトンとは、一般的にコイルを巻くためのブラケットのことです。いくつかの大きな固定 インダクタ or adjustable インダクタ (such as oscillating coils, choke coils, etc.), most of which are enameled wire (or yarn-covered wire) around the skeleton, and then the magnetic core or copper core, iron core, etc. Installed into the inner cavity of the skeleton to increase its inductance. The skeleton is usually made of plastic, bakelite, and ceramics, and can be made into different shapes according to actual needs. Small インダクタ (such as color-coded インダクタ) generally do not use a bobbin, but instead have the enameled wire wound directly around the core. Air-core インダクタ (also known as unwrapped coils or air-core coils, mostly used in high-frequency circuits) do not use magnetic cores, skeletons and shields, etc., but are first wound on the mold and then take off the mold, and the coil is pulled between each coil. Drive a certain distance.

2. Winding Winding refers to a group of coils with specified functions, which is the basic component of インダクタ. There are single-layer and multi-layer windings. There are two types of single-layer windings: dense winding (conductors are wound one turn after another) and intermediate winding (there is a certain distance between each turn of wires during winding); multi-layer windings have layered flat winding, random winding Winding, honeycomb winding, etc.
3.磁気コアと磁気ロッド磁気コアと磁気ロッドは、一般にニッケル-亜鉛フェライト(NXシリーズ)またはマンガン-亜鉛フェライト(MXシリーズ)およびその他の材料でできており、「I」字型、柱型、帽子型です。 、「E」シェイプ、シェイプおよびその他のシェイプが可能です。

4.鉄芯鉄芯材は主にケイ素鋼板やパーマロイなどがあり、その形状は主に「E」型です。

5. Shielding cover In order to prevent the magnetic field generated by some インダクタ from affecting the normal operation of other circuits and components, a metal screen cover (such as the oscillation coil of a semiconductor radio, etc.) is added to it. The use of shielded インダクタ will increase the loss of the coil and reduce the Q value.

6. Packaging materials After some インダクタ (such as color code インダクタ, color ring インダクタ, etc.) are wound, the coils and magnetic cores are sealed with packaging materials. The encapsulation material is plastic or epoxy resin.