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June 15, 2026, Tokyo, Japan TDK Corporation has released a new high performance SMD power inductor series tailored for AI servers, high performance computing platforms, and DDR5 memory power rails.
Engineered for ultra high power density and low DC resistance (DCR), this SMD power inductor uses proprietary metal composite core technology and precision flat wire winding to support high frequency operation up to 5 MHz while delivering exceptional saturation current and thermal stability. The fully shielded structure drastically reduces magnetic flux leakage and electromagnetic interference (EMI), enabling tighter PCB layout and higher component density in data center power modules.
Designed to operate reliably from −40°C to +125°C, the new SMD power inductor addresses the strict efficiency and thermal demands of next generation multi kilowatt server power designs. TDK’s engineering team confirmed that the SMD power inductor lowers power conversion loss by more than 14% compared to conventional molded inductors, directly improving energy efficiency and reducing cooling loads in large scale data center facilities. Mass production has commenced, with major cloud infrastructure providers and server OEMs already qualifying the device for 2026–2027 platform rollouts.
Engineered for ultra high power density and low DC resistance (DCR), this SMD power inductor uses proprietary metal composite core technology and precision flat wire winding to support high frequency operation up to 5 MHz while delivering exceptional saturation current and thermal stability. The fully shielded structure drastically reduces magnetic flux leakage and electromagnetic interference (EMI), enabling tighter PCB layout and higher component density in data center power modules.
Designed to operate reliably from −40°C to +125°C, the new SMD power inductor addresses the strict efficiency and thermal demands of next generation multi kilowatt server power designs. TDK’s engineering team confirmed that the SMD power inductor lowers power conversion loss by more than 14% compared to conventional molded inductors, directly improving energy efficiency and reducing cooling loads in large scale data center facilities. Mass production has commenced, with major cloud infrastructure providers and server OEMs already qualifying the device for 2026–2027 platform rollouts.
